In the realm of advanced semiconductor technology, a transformation is taking shape that may redefine how we approach chip manufacturing and designCentral to this evolution is the emerging use of glass substrates, which present both cutting-edge possibilities and significant challengesOne notable challenge in this shift is the implementation of Through Glass Vias (TGV), essential for enabling efficient data and power transmission in these new architectures.

AMD is at the forefront of this innovation wave, having secured a patent (12080632) covering glass core substrate technology, which positions them to leverage the benefits of this material while protecting their intellectual property from potential infringement claims by competitorsThis strategic move indicates that AMD has delved deeply into the research and development of the technologies related to glass substrates, marking a shift from traditional organic substrates commonly utilized in multi-chip processors

As companies like AMD and others look to the future, the transition to glass is anticipated to represent a significant upgrade in performance metrics, particularly in data centers.

Major players in the semiconductor industry, such as Intel and Samsung, are actively investigating the potential of glass substrates to power the next generation of processorsAlthough AMD has shifted its manufacturing processes to rely on third-party foundries like TSMC, it remains deeply involved in R&D to customize and optimize products according to its partners’ technologiesThis collaboration is vital, given that glass substrates, with their distinct characteristics, can influence performance criteria like heat management, mechanical strength, and signal routing efficiency.

The implementation of TGV is a key consideration when integrating glass substrates into electronic designs

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TGVs are vertically etched channels created within the glass substrates to facilitate the flow of electrical signals and power, and while there are existing methods for creating these channels—such as laser drilling and magnetic self-assembly—many of these technologies are still developing in terms of practical applicationsThe precision required for laser drilling, for instance, must be finely calibrated to ensure quality and reliability.

An additional layer of complexity in the landscape of advanced packaging is the redistribution layer (RDL), which must adapt to the presence of glassWhile the main glass substrates are transitioning to glass, RDL continues to utilize organic dielectric materials and copper—but they must be meticulously integrated onto the glass wafer’s surfaceThe transition away from traditional materials to integrating glass raises the stakes of manufacturing processes, requiring new methods and tools.

AMD's patent also reveals a novel approach to bonding multiple glass substrates using copper-based bonding techniques instead of conventional solder bump methods

This enhances reliability, negates the need for bottom-filling materials, and allows for efficient stacking of several glass substrates, optimizing space and performance in high-density applications.

Although AMD touts the advantages of glass substrates—such as enhanced thermal management, mechanical strength, and improved signal routing—these attributes are especially attractive for data center processorsHowever, the patent documentation also posits that glass substrates could be viable for a wider range of applications requiring high-density interconnections, like mobile devices and advanced sensorsThis optimism may seem somewhat overstated at present, given the nascent state of the technology.

Commentators, such as Yole, suggest that the advent of glass substrates in advanced packaging signals a significant turning point in the industry

Announced by Intel in September 2023, this technology cycle follows previous advancements in organic and ceramic substrates, aiming to overcome existing manufacturing challenges while enhancing performance, efficiency, and scalability, especially relevant in the realms of high-performance computing (HPC) and artificial intelligence (AI).

Despite ongoing challenges with fragility during handling and processing, which necessitate a careful approach to manufacturing, the potential advantages of adopting glass substrates are compellingThese advantages include improved size stability, thermal conductivity, and electrical performance relative to traditional organic materials that have dominated the market for years.

Indeed, the roadmap for extensive adoption of glass substrates hinges upon addressing foundational hurdles that pertain not only to manufacturers but also to suppliers of equipment, materials, and sensors involved in the quality assessment processes

These factors could ultimately dictate the feasibility of glass technology in the semiconductor market.

In terms of ecosystem development, the landscape for glass substrates is rapidly evolving following Intel's groundbreaking efforts over the past year, which laid the groundwork for widespread industry adoptionIntel's investment in research and development, encompassing an impressive portfolio of over 600 patents related to Glass Core Substrates (GCS), has set the stage for the semiconductor industry to consider glass as a legitimate candidate for future applicationsFollowing suit, Samsung recently entered the glass substrate production sphere, marking another milestone that underscores the increasing investment and interest in this innovative technology.

Moreover, the emergence of new players like Absolics and their considerable investments—such as the $600 million funding round backed by SKC—highlights the shifting dynamics in the market

Absolics distinguishes itself as the first company dedicated solely to the production of glass substrates, employing a different technology path as compared to Intel’s approach.

The rising interest in TGVs serves as a linchpin in establishing the sector’s alignment around glass substrate manufacturingTGVs facilitate higher interlayer connection densities, bolster the signal integrity of high-speed circuits, and mitigate challenges such as signal loss and interferenceThe convergence of glass technology with panel-level packaging (PLP) further enhances prospects for cost-efficient and high-performance solutions, allowing increased chip density and manufacturing efficiency.

In conclusion, glass substrates present a promising frontier in advanced integrated circuit substrates and packaging technologies